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Printed Proceedings of the InterPACK 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2018)
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Printed Proceedings of the InterPACK 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2018)  Paperback,  言語:ENG

  • ウェブストア価格 ¥39,178(本体¥35,617)
  • American Society of Mechanical Engineers,U.S.(2019/11発売)
  • ポイント 712pt
  • 海外からお取り寄せ(通常6~9週間)
2013 Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2013): Volume 1
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2013 Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2013): Volume 1  Paperback,  言語:ENG

Engineers, American Society of Mechanical

  • ウェブストア価格 ¥52,661(本体¥47,874)
  • American Society of Mechanical Engineers,U.S.(2013/12発売)
  • ポイント 956pt
  • 海外からお取り寄せ(通常6~9週間)
2013 Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2013): Volume 2
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2013 Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2013): Volume 2  Paperback,  言語:ENG

Engineers, American Society of Mechanical

  • ウェブストア価格 ¥48,082(本体¥43,711)
  • American Society of Mechanical Engineers,U.S.(2013/12発売)
  • ポイント 874pt
  • 海外からお取り寄せ(通常6~9週間)
ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Volume 1: Thermal Management
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ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Volume 1: Thermal Management  Paperback,  言語:ENG

ASME

  • ウェブストア価格 ¥52,661(本体¥47,874)
  • American Society of Mechanical Engineers,U.S.(2015/07発売)
  • ポイント 956pt
  • 海外からお取り寄せ(通常6~9週間)
ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing, Interconnect and Reliability, Fun
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  • ポイントキャンペーン

ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing, Interconnect and Reliability, Fun  Paperback,  言語:ENG

ASME

  • ウェブストア価格 ¥48,082(本体¥43,711)
  • American Society of Mechanical Engineers,U.S.(2015/07発売)
  • ポイント 874pt
  • 海外からお取り寄せ(通常6~9週間)
ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applicat
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ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applicat  Paperback,  言語:ENG

ASME

  • ウェブストア価格 ¥48,082(本体¥43,711)
  • American Society of Mechanical Engineers,U.S.(2015/07発売)
  • ポイント 874pt
  • 海外からお取り寄せ(通常6~9週間)
Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021)
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Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021)  Paperback,  言語:ENG

  • ウェブストア価格 ¥47,828(本体¥43,480)
  • American Society of Mechanical Engineers,U.S.(2022/05発売)
  • ポイント 868pt
  • 海外からお取り寄せ(通常6~9週間)
ASME 2020 Proceedings of the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020)
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  • 予約
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ASME 2020 Proceedings of the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020)  Paperback,  言語:ENG

  • ウェブストア価格 ¥45,283(本体¥41,167)
  • American Society of Mechanical Engineers,U.S.(2024/05発売)
  • ポイント 822pt
  • ご予約受付中。出版後の入荷・発送
Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)
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Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)  Paperback,  言語:ENG

  • ウェブストア価格 ¥66,908(本体¥60,826)
  • American Society of Mechanical Engineers,U.S.(2020/06発売)
  • ポイント 1,216pt
  • 海外取次在庫